High density CU – structures up to 210 µm end thickness are separated in the processing machine (German: LBA = Leiterbahnautomat) with 150A / m².
Every electroplating process is equipped with a vibration device which removes blowing air bubbles from the smallest boreholes. It also guarantees a regular deposition rate of 25 µm minimum in the sleeve. Three to four m² throughputs per hour.
News
02.02.2015
pcbInmotion GmbH takes over JKS Vertriebsgesellschaft mbH ... more
15.03.2011
New employee for expanding the capacity ... more
04.03.2011
Update of "Wer liefert Was?" entry ... more