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JKS Leiterplatten

Electroplating

High density CU – structures up to 210 µm end thickness are separated in the processing machine (German: LBA = Leiterbahnautomat) with 150A / m².
Every electroplating process is equipped with a vibration device which removes blowing air bubbles from the smallest boreholes. It also guarantees a regular deposition rate of 25 µm minimum in the sleeve. Three to four m² throughputs per hour.

JKS Galvanik JKS Galvanik

 




News


02.02.2015
pcbInmotion GmbH takes over JKS Vertriebsgesellschaft mbH
... more

15.03.2011
New employee for expanding the capacity
... more

04.03.2011
Update of "Wer liefert Was?" entry
... more

20.01.2011
Update of Internet presence
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04.01.2011
New employees in JKS Team
... more

01.12.2010
New managing directors of JKS Leiterplatten GmbH commence work
... more

01.11.2010
UL Certification renewed
... more